Effect of Diamine Cross-linker on the Curing Behavior of Eugenol-Based Epoxy Thermoset

Presenter Information

Himanshubhai Patel

Category

Sciences and Technology

Department

Material Science

Student Status

Graduate

Research Advisor

Dr. Ram Gupta

Document Type

Event

Location

Student Center Ballroom

Start Date

10-4-2025 2:00 PM

End Date

10-4-2025 4:00 PM

Description

With the increasing need for sustainable and high-performance materials, this research focuses on the development of eugenol-based epoxy thermosets as a renewable alternative to fossil-based polymers. Eugenol, a naturally derived phenolic compound, undergoes a multi-step synthesis process, including functionalization with allyl bromide, thiol-ene reaction, and epoxidation to produce an epoxy resin. This study investigate the effect of diamine cross-linkers on the curing behavior and mechanical properties of the thermoset. The study analyzes different diamines, including EDA (ethylenediamine), BDA (butanediamine) and HDA (hexamethylenediamine) assessing their impact on cross-link density, flexibility, and thermal stability. Thermal curing is applied to achieve a stable polymer network, and various characterization techniques are employed, including FT-IR, 1H NMR, DSC, TGA/DTGA, DMA, tensile testing, and gel fraction measurements. The results indicate that the glass transition temperature (Tg) of the cured thermoset ranges from 100 to 110 oC, depending on the diamine used. The thermal degradation temperature (T5%, initial weight loss) is observed to be between 320 oC and 350 oC, demonstrating thermal stability. The tensile strength of the optimized thermoset reaches approximately 7.0 MPa, highlighting its mechanical performance. Additionally, the material exhibits flexibility, enhanced thermomechanical properties, and a well-defined cross-linked structure, making it a candidate for industrial applications in coatings, adhesives, and advanced composites.

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Apr 10th, 2:00 PM Apr 10th, 4:00 PM

Effect of Diamine Cross-linker on the Curing Behavior of Eugenol-Based Epoxy Thermoset

Student Center Ballroom

With the increasing need for sustainable and high-performance materials, this research focuses on the development of eugenol-based epoxy thermosets as a renewable alternative to fossil-based polymers. Eugenol, a naturally derived phenolic compound, undergoes a multi-step synthesis process, including functionalization with allyl bromide, thiol-ene reaction, and epoxidation to produce an epoxy resin. This study investigate the effect of diamine cross-linkers on the curing behavior and mechanical properties of the thermoset. The study analyzes different diamines, including EDA (ethylenediamine), BDA (butanediamine) and HDA (hexamethylenediamine) assessing their impact on cross-link density, flexibility, and thermal stability. Thermal curing is applied to achieve a stable polymer network, and various characterization techniques are employed, including FT-IR, 1H NMR, DSC, TGA/DTGA, DMA, tensile testing, and gel fraction measurements. The results indicate that the glass transition temperature (Tg) of the cured thermoset ranges from 100 to 110 oC, depending on the diamine used. The thermal degradation temperature (T5%, initial weight loss) is observed to be between 320 oC and 350 oC, demonstrating thermal stability. The tensile strength of the optimized thermoset reaches approximately 7.0 MPa, highlighting its mechanical performance. Additionally, the material exhibits flexibility, enhanced thermomechanical properties, and a well-defined cross-linked structure, making it a candidate for industrial applications in coatings, adhesives, and advanced composites.